a)

b)
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b)

00000EC465121803

PART C
Answer any two full questions, each carries 20 marks.
Explain with figures the fabrication of a diaphragm based pressure sensor using
bulk micromachining.
Explain with figures any three surface bonding techniques.
Discuss the various levels of micro system packaging
With necessary diagrams, explain the anodic bonding process
Explain with figures the Micro stereo lithography process. What are its
advantages over micromachining techniques?
Write a brief note on
1. RFMEMS
1] NEMS

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