a)

b)

a)
b)
a)

b)

G192119 Pages:2

PART C
Answer any two full questions, each carries 20 marks.
Explain surface micro machining process for fabricating a mechanical structure

with neat sketches.

State the objectives and explain the general considerations in micro system
packaging

Explain LIGA process in detail.

Explain with figures two RF MEMS applications

Explain the three levels of micro system packaging

Explain Anodic bonding and Silicon Fusion Bonding

Page 2of 2

(10)

(10)

(10)
(10)
(10)
(10)