b)

10000EC465122001

Explain the following bonding techniques with figures

a) Silicon-on-Insulator b)Wire bonding
Explain the fabrication of a Micro gear using LIGA process with neat sketches.
Discuss the challenges involved in BioMEMS. List two applications of
BioMEMS.
Explain the three levels of micro system packaging.

Explain the different stages in the Assembly of micro systems.

RE

Page 2 of 2

(10)

(10)
(10)

(10)
(10)